CAJ | 학술논문

BGA枕头焊点的锡膏和锡球完全没有融合成为一体,倒过来看就像头压在枕头上面。介绍了四种有效的检测方法。从设计、材料和工艺三方面分析了枕头缺陷的潜在影响因素。选取PCB玻璃态转化温度、钢网厚度、BGA贴装偏移量和回流焊炉链条速度四个因素进行两水平全因子实验设计,在成功复制枕头缺陷的基础上,分析了各因素的影响作用,得出了链条速度是最显著的影响因素。
BGA침두한점적석고화석구완전몰유융합성위일체,도과래간취상두압재침두상면。개소료사충유효적검측방법。종설계、재료화공예삼방면분석료침두결함적잠재영향인소。선취PCB파리태전화온도、강망후도、BGA첩장편이량화회류한로련조속도사개인소진행량수평전인자실험설계,재성공복제침두결함적기출상,분석료각인소적영향작용,득출료련조속도시최현저적영향인소。
Solder paste and solder ball are not completely fused into one BGA head-in-pillow, Upside down as head on a pillow. Four effective methods for observing are introduced. And analyze the potential factors of this defect from design, materials and process. Then select PCB θg point, stencil thickness, BGA mounting deviant and reflow chain speed as four factors to DOE. After successfully copy the head-in-pillow defect, discuss the effect of all factors. Finally find that the chain speed is the most significant one.