电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2012年
2期
86-89
,共4页
表面贴装技术%温度曲线%返修技术
錶麵貼裝技術%溫度麯線%返脩技術
표면첩장기술%온도곡선%반수기술
SMT%Reflow soldering profile%Rework technology
总结了无铅BGA返修的工艺特点、技术要求和温度曲线设置方法;介绍了一种暗红外返修系统的结构与性能特点;结合实际工作详细描述了某航天产品无铅BGA返修的实施工艺,重点阐述了返修时高可靠性的实现方法;从而验证了基于此设备的工艺方法对于无铅BGA返修的有效性。
總結瞭無鉛BGA返脩的工藝特點、技術要求和溫度麯線設置方法;介紹瞭一種暗紅外返脩繫統的結構與性能特點;結閤實際工作詳細描述瞭某航天產品無鉛BGA返脩的實施工藝,重點闡述瞭返脩時高可靠性的實現方法;從而驗證瞭基于此設備的工藝方法對于無鉛BGA返脩的有效性。
총결료무연BGA반수적공예특점、기술요구화온도곡선설치방법;개소료일충암홍외반수계통적결구여성능특점;결합실제공작상세묘술료모항천산품무연BGA반수적실시공예,중점천술료반수시고가고성적실현방법;종이험증료기우차설비적공예방법대우무연BGA반수적유효성。
Summarize the characteristics of lead-free BGA rework process, technical requirements and methods of setting temperature curve; describe the structure and performance characteristics of a IR rework system; combine with work experience, describe a product's implementation of lead-free BGA rework process in detail, which focuses on the repair methods of high reliability; Prove the effectiveness of the method based on this machine for lead-free BGA rework process.