电子设计工程
電子設計工程
전자설계공정
ELECTRONIC DESIGN ENGINEERING
2012年
8期
125-129
,共5页
赵玉%许家栋%张官荣%孔玲
趙玉%許傢棟%張官榮%孔玲
조옥%허가동%장관영%공령
可编程片上系统%LXI总线%1553B总线%嵌入式实时操作系统
可編程片上繫統%LXI總線%1553B總線%嵌入式實時操作繫統
가편정편상계통%LXI총선%1553B총선%감입식실시조작계통
SOPC%LXI bus%1553B bus%real-time embedded operating system
针对基于LXI仪器总线的1553B通讯模块开发需求,提出了一种基于SOPC的1553B总线通讯解决方法。以SOPC技术为支撑,在一块FPGA上嵌入NiosⅡ软核处理器、以太网控制组件、1553B控制组件和RAM模块;通过移植嵌入式实时操作系统μC/OSⅡ和LwIP协议,实现了TCP/IP协议和1553B总线协议;最后开发了模块的仪器驱动程序。本文设计方法开发难度低,设计模块体积小、便于升级,具有较强的工程应用和经济价值。
針對基于LXI儀器總線的1553B通訊模塊開髮需求,提齣瞭一種基于SOPC的1553B總線通訊解決方法。以SOPC技術為支撐,在一塊FPGA上嵌入NiosⅡ軟覈處理器、以太網控製組件、1553B控製組件和RAM模塊;通過移植嵌入式實時操作繫統μC/OSⅡ和LwIP協議,實現瞭TCP/IP協議和1553B總線協議;最後開髮瞭模塊的儀器驅動程序。本文設計方法開髮難度低,設計模塊體積小、便于升級,具有較彊的工程應用和經濟價值。
침대기우LXI의기총선적1553B통신모괴개발수구,제출료일충기우SOPC적1553B총선통신해결방법。이SOPC기술위지탱,재일괴FPGA상감입NiosⅡ연핵처리기、이태망공제조건、1553B공제조건화RAM모괴;통과이식감입식실시조작계통μC/OSⅡ화LwIP협의,실현료TCP/IP협의화1553B총선협의;최후개발료모괴적의기구동정서。본문설계방법개발난도저,설계모괴체적소、편우승급,구유교강적공정응용화경제개치。
To meet the requirement of 1553B bus communication module with LXI,one approach was proposed based on system on one-chip(SOPC) technology.With the SOPC,the NiosII soft core processor,Ethernet interface controller,1553B interface controller and the RAM were embedded in one FPGA chip.For the software,the μC/OSⅡ operating system and the LwIP stack were transplanted.Based on that,the Web server,the TCP/IP protocol and 1553B function were realized.And then,the instrument driver was developed for designed module.The approach is easy to design and the instrument convenient to upgrade,which have strong engineering value and economic benefit.