CAJ | 학술논문

基于过孔的实际参数，利用HFSS和CST建立了六层高速PCB板过孔的全波分析理论模型。在1-10GHz频段，研究过孔的四个重要参数，包括孔径及内外径的差值比、过孔长度、基板介电常数等，对信号传输性能的影响；并选择射频常用频点，f=5GHz进行了仿真验证，得到了优化信号完整性的设计参数：内径不大于10rail，外径不大于25mil，过孔长度小于55rail，内外径差值越大越好，比值优化为l：2．3。仿真结果表明：理论模型是实际有效的，并且优化的设计参数可以保证过孔的阻抗连续性和较小的反射损耗、插入损耗。这对高频PCB板的设计有很好的指导意义。
기우과공적실제삼수，이용HFSS화CST건립료륙층고속PCB판과공적전파분석이론모형。재1-10GHz빈단，연구과공적사개중요삼수，포괄공경급내외경적차치비、과공장도、기판개전상수등，대신호전수성능적영향；병선택사빈상용빈점，f=5GHz진행료방진험증，득도료우화신호완정성적설계삼수：내경불대우10rail，외경불대우25mil，과공장도소우55rail，내외경차치월대월호，비치우화위l：2．3。방진결과표명：이론모형시실제유효적，병차우화적설계삼수가이보증과공적조항련속성화교소적반사손모、삽입손모。저대고빈PCB판적설계유흔호적지도의의。
Co-simulation of the theoretical via model is presented by using HFSS and CST, with the sweep frequency ranges 1- 10 GHz. The impact of structure parameters on signal integrity is analysised, including the via diameter, the ratio of inner and outer diameter, the via length and the relative permittivity of substrate. We select f=5 GHz as the RF validation frequency. The simulation results show that inner radius using no more than 10 mil, outer radius using no more than 25 mil and through-hole length using less than 55 mil can guarantee the continuity of impedance and cost lower insertion loss. The optimal ratio between inner diameter and outer diameter is 1 to 2.3. Above all, the model is practical and effective. It＇s a good guidance for the design of high-frequency Printed Circuit Board