电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2012年
2期
79-81
,共3页
无铅%焊接工艺%剪切力
無鉛%銲接工藝%剪切力
무연%한접공예%전절력
Lead-free%Bonding Technology%Shearing
介绍了无铅化推广以来无铅工艺研究的紧迫性;开展了多种封装阻容器件的焊接实验工作;通过对焊点剪切力性能的对比和分析,总结了焊接时间对于焊点改善焊接质量的作用;通过观察不良焊点的剪切力试验断面图和微观视图,阐述了焊接时间对于改善焊点质量的原因;发现在本实验条件下,适当延长手工焊接时间,有助于改善焊点质量。
介紹瞭無鉛化推廣以來無鉛工藝研究的緊迫性;開展瞭多種封裝阻容器件的銲接實驗工作;通過對銲點剪切力性能的對比和分析,總結瞭銲接時間對于銲點改善銲接質量的作用;通過觀察不良銲點的剪切力試驗斷麵圖和微觀視圖,闡述瞭銲接時間對于改善銲點質量的原因;髮現在本實驗條件下,適噹延長手工銲接時間,有助于改善銲點質量。
개소료무연화추엄이래무연공예연구적긴박성;개전료다충봉장조용기건적한접실험공작;통과대한점전절력성능적대비화분석,총결료한접시간대우한점개선한접질량적작용;통과관찰불량한점적전절력시험단면도화미관시도,천술료한접시간대우개선한점질량적원인;발현재본실험조건하,괄당연장수공한접시간,유조우개선한점질량。
The urgency of researching on lead-free technology is introduced since lead-free manufacture has been spread. The soldering experiment on several kinds of package resistances and capacitances is made. Contrast and analyze the shearing performance, the effects of boding time on improving the quality of solders are summarized. By observing the pictures of bad solders, the factors of soldering time on improving solder quality are elaborated. Under the condition of this experiment, prolonging bonding time suitably can improve the solder quality.