电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2012年
2期
75-78
,共4页
SAC/Cu焊点%加载速率%剪切强度
SAC/Cu銲點%加載速率%剪切彊度
SAC/Cu한점%가재속솔%전절강도
SAC/Cu solder joints%Loading rate%Shear strength
通过对Sn0.3Ag0.7Cu/Cu和Sn3.0Ag0.5Cu/Cu焊点进行剪切测试结果表明：两种钎料焊点的剪切强度与加载速率有着明显的相关性,即焊点的剪切强度都随着加载速率的增加而增加。当加载速率为0.01 mm/s时,断裂模式为韧脆混合断裂,随着加载速率的增加,两种钎料焊点断口的韧窝数量不断增加,呈现韧性断裂特征,断口以韧窝为主。另外在相同加载速率下,Sn3.0Ag0.5Cu/Cu焊点断口的韧窝数量和分布情况都优于Sn0.3Ag0.7Cu/Cu焊点,即其韧性断裂的趋势更加明显,剪切强度更大。
通過對Sn0.3Ag0.7Cu/Cu和Sn3.0Ag0.5Cu/Cu銲點進行剪切測試結果錶明：兩種釬料銲點的剪切彊度與加載速率有著明顯的相關性,即銲點的剪切彊度都隨著加載速率的增加而增加。噹加載速率為0.01 mm/s時,斷裂模式為韌脆混閤斷裂,隨著加載速率的增加,兩種釬料銲點斷口的韌窩數量不斷增加,呈現韌性斷裂特徵,斷口以韌窩為主。另外在相同加載速率下,Sn3.0Ag0.5Cu/Cu銲點斷口的韌窩數量和分佈情況都優于Sn0.3Ag0.7Cu/Cu銲點,即其韌性斷裂的趨勢更加明顯,剪切彊度更大。
통과대Sn0.3Ag0.7Cu/Cu화Sn3.0Ag0.5Cu/Cu한점진행전절측시결과표명：량충천료한점적전절강도여가재속솔유착명현적상관성,즉한점적전절강도도수착가재속솔적증가이증가。당가재속솔위0.01 mm/s시,단렬모식위인취혼합단렬,수착가재속솔적증가,량충천료한점단구적인와수량불단증가,정현인성단렬특정,단구이인와위주。령외재상동가재속솔하,Sn3.0Ag0.5Cu/Cu한점단구적인와수량화분포정황도우우Sn0.3Ag0.7Cu/Cu한점,즉기인성단렬적추세경가명현,전절강도경대。
It was found that the shear strength of two kinds of solder joints has obvious correlation with the loading rate based on the shear test results of the Sn0.3 Ag0.7 Cu/Cu solder joints and Sn3.0 Ag0.5 Cu/Cu solder joints. With the increase of loading rate, the shear strength gained. When the loading rate of the solder joint was 0.01 mm/s, the fracture mode was ductile- brittle mixed fracture. With the increase of the loading rate, the dimple number of shear fracture of two kinds of solder joint increase, the fractograph exhibited typical ductile dimple fracture pattern. Moreover, Sn3.0 Ag0.5 Cu/Cu solder joint fracture of dimples number and distribution situation are better than the Sn0.3 Ag0.7 Cu/Cu solder joints at the same loading rate, the ductile fracture trends more evident and shear strength
