兼具耐CAF、优良PCB加工性及耐热性无铅覆铜板的开发
겸구내CAF、우량PCB가공성급내열성무연복동판적개발
Development of a lead-free CCL with better CAF,PCB workability and heat resistance
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2012年 6期 16-18 ,共3页

    吴奕辉%方克洪

    오혁휘%방극홍

    无铅%加工性%改性双氰胺%覆铜板 無鉛%加工性%改性雙氰胺%覆銅闆
    무연%가공성%개성쌍청알%복동판
    lead-free process%PCB workability%modified dicy%copper clad laminate
    通过改性双氰胺与改性酚醛复合固化环氧树脂,在保证原来FR-4板料的良好加工性基础上提高了板材耐热性,并且提高了耐CAF性能,开发出满足无铅焊接的覆铜板。
    통과개성쌍청알여개성분철복합고화배양수지,재보증원래FR-4판료적량호가공성기출상제고료판재내열성,병차제고료내CAF성능,개발출만족무연한접적복동판。
    A copper clad laminate cured by modified dicy and modified phenolic novolac has been developed.This material shows better performance on PCB process workability,heat resistance,water absorption,and anti-CAF.It is suitable for lead-free process.
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