电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
7期
6-8,18
,共4页
微电子机械系统%芯片级封装%倒装焊
微電子機械繫統%芯片級封裝%倒裝銲
미전자궤계계통%심편급봉장%도장한
MEMS packaging%wafer level package%flip chip bonding
综述了微电子机械系统（MEMS）封装主流技术,包括芯片级封装、器件级封装和系统及封装技术进行了。重点介绍了圆片级键合、倒装焊等封装技术。并对MEMS封装的技术瓶颈进行了分析。
綜述瞭微電子機械繫統（MEMS）封裝主流技術,包括芯片級封裝、器件級封裝和繫統及封裝技術進行瞭。重點介紹瞭圓片級鍵閤、倒裝銲等封裝技術。併對MEMS封裝的技術瓶頸進行瞭分析。
종술료미전자궤계계통（MEMS）봉장주류기술,포괄심편급봉장、기건급봉장화계통급봉장기술진행료。중점개소료원편급건합、도장한등봉장기술。병대MEMS봉장적기술병경진행료분석。
The technologies of MEMS packaging are introduced, including three promising technologies： Wafer Level Packaging, Device Level, System Level Packaging. And the emphasis about using wafer level bonding, flip chip bonding technology. Then several reliability issues in MEMS packaging are pointed out, and a forecast is given for its future trends.
