电子测试
電子測試
전자측시
ELECTRONIC TEST
2013年
24期
253-254
,共2页
电子封装材料%无压熔渗%高体积分数SiC/Al%双连通结构%封装材料高体积分数
電子封裝材料%無壓鎔滲%高體積分數SiC/Al%雙連通結構%封裝材料高體積分數
전자봉장재료%무압용삼%고체적분수SiC/Al%쌍련통결구%봉장재료고체적분수
Electronic packaging materials%Pressureless infiltration%High volume fraction SiC/Al%Co-continued structure
采用无压熔渗法制备了用于特种电子封装的高体积分数SiC增强Al复合材料。复合材料中SiC含量高于60vol.%， SiC陶瓷相均匀分布于Al合金基体中.增强相和合金基体局部形成双连通结构，保证SiC/Al复合材料有低膨胀系数和高热导；复合材料力学性能优良，韧度优于传统陶瓷封装材料。高体分SiC/Al和半导体材料热匹配良好，综合性能优异，满足特种高可靠性电子系统封装材料使用要求。
採用無壓鎔滲法製備瞭用于特種電子封裝的高體積分數SiC增彊Al複閤材料。複閤材料中SiC含量高于60vol.%， SiC陶瓷相均勻分佈于Al閤金基體中.增彊相和閤金基體跼部形成雙連通結構，保證SiC/Al複閤材料有低膨脹繫數和高熱導；複閤材料力學性能優良，韌度優于傳統陶瓷封裝材料。高體分SiC/Al和半導體材料熱匹配良好，綜閤性能優異，滿足特種高可靠性電子繫統封裝材料使用要求。
채용무압용삼법제비료용우특충전자봉장적고체적분수SiC증강Al복합재료。복합재료중SiC함량고우60vol.%， SiC도자상균균분포우Al합금기체중.증강상화합금기체국부형성쌍련통결구，보증SiC/Al복합재료유저팽창계수화고열도；복합재료역학성능우량，인도우우전통도자봉장재료。고체분SiC/Al화반도체재료열필배량호，종합성능우이，만족특충고가고성전자계통봉장재료사용요구。
Pressureless infiltration technique was employed to prepare high volume fraction SiC reinforced Al alloy matrix composites for special electronic packaging.The reinforcing materials SiC occupied more than 60vol.% in the composite,and well distributed in the alloy matrix.Each material phase forms cocontinued structure,which guaranteed low coefficient of thermal expansion and high thermal conductivity. The composite’s mechanical performance is improved compared with monolithic ceramics for electronic packaging.Due to its thermal properties well matching the semi-conductor and its excellent comprehensive performance,the composite fulfill the repuirement of high reliable electronic packaging.
