电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2012年
4期
31-33,37
,共4页
封装%静电电压超标%晶圆清洗%改进方案
封裝%靜電電壓超標%晶圓清洗%改進方案
봉장%정전전압초표%정원청세%개진방안
packaging%exceeding the standard of electrostatic potential%wafer cleaning%improving projects
分析划片后的晶圆在清洗过程中静电电压严重超标的原因,提出4种改进方案,采用16种晶圆进行了验证。结果表明：清洗过程中关闭清洗机剥离胶膜用反冲气,操作人员佩戴防静电腕带,在取出晶圆过程中采用手持式可移动离子风枪对晶圆进行风淋,可解决长期存在的晶圆划片后清洗过程中表面静电电压严重超标的问题。
分析劃片後的晶圓在清洗過程中靜電電壓嚴重超標的原因,提齣4種改進方案,採用16種晶圓進行瞭驗證。結果錶明：清洗過程中關閉清洗機剝離膠膜用反遲氣,操作人員珮戴防靜電腕帶,在取齣晶圓過程中採用手持式可移動離子風鎗對晶圓進行風淋,可解決長期存在的晶圓劃片後清洗過程中錶麵靜電電壓嚴重超標的問題。
분석화편후적정원재청세과정중정전전압엄중초표적원인,제출4충개진방안,채용16충정원진행료험증。결과표명：청세과정중관폐청세궤박리효막용반충기,조작인원패대방정전완대,재취출정원과정중채용수지식가이동리자풍창대정원진행풍림,가해결장기존재적정원화편후청세과정중표면정전전압엄중초표적문제。
Analyzing the causes of exceeding the standard of electrostatic potential in wafer cleaning process after sawing,we proposed 4 improving projects and validated them on 16 different kinds of wafers.The results are as follows： we suggest that the pushing power which is used to take off the blue tape should be turned off in the cleaning process,the operator can shower the wafer by using a hand-held mobile ion air gun,wearing anti-static wrist strap in the process of removing the wafer,which can solve the problem of exceeding the standard of static electricity during the wafer cleaning process.
