CAJ | 학술논문

　　通过对几种常见的检测模式及缺陷分析方法进行介绍，并对几种常见器件进行检测、分析，总结出一套针对半导体器件及封装领域常见缺陷的检测方法，给出了具体的缺陷分析理论，为利用超声手段对器件进行无损检测和质量控制提供了重要参考。
　　통과대궤충상견적검측모식급결함분석방법진행개소，병대궤충상견기건진행검측、분석，총결출일투침대반도체기건급봉장영역상견결함적검측방법，급출료구체적결함분석이론，위이용초성수단대기건진행무손검측화질량공제제공료중요삼고。
T hrough the introduction of several com m on detection m odels and defect analysis m ethod, the detection and analysis of several com m on devices,sum m ed up a set of detection m ethod for sem iconductor device and package defects,and the specific defects analysis in theory,and provides im portantreference fornondestructive testing and quality controlofdevice using ultrasonic m ethod.