电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
10期
14-18
,共5页
LTCC%平面零收缩%收缩率不均匀度%层压%共烧
LTCC%平麵零收縮%收縮率不均勻度%層壓%共燒
LTCC%평면령수축%수축솔불균균도%층압%공소
LTCC%pane zero-shrink%shrinkage disuniformity%laminating%co-firing
LTCC基板的共烧收缩均匀性受到材料和加工工艺的影响较大，使烧成基板的平面尺寸难以精确控制，成为LTCC基板实现高性能应用的一大障碍，需要重点突破。文章在简要介绍了常见平面零收缩LTCC基板制作工艺技术的基础上，通过精选LTCC生瓷带并设计10层和20层LTCC互连实验基板，提出评价指标，根据自有条件开展了自约束烧结平面零收缩LTCC基板的制作工艺研究，重点突破了层压与共烧工艺，将LTCC基板平面尺寸的烧结收缩率不均匀度由通常的±0.3%~±0.4%减小到小于±0.04%，可以较好地满足高密度高频MCM研制的需要。
LTCC基闆的共燒收縮均勻性受到材料和加工工藝的影響較大，使燒成基闆的平麵呎吋難以精確控製，成為LTCC基闆實現高性能應用的一大障礙，需要重點突破。文章在簡要介紹瞭常見平麵零收縮LTCC基闆製作工藝技術的基礎上，通過精選LTCC生瓷帶併設計10層和20層LTCC互連實驗基闆，提齣評價指標，根據自有條件開展瞭自約束燒結平麵零收縮LTCC基闆的製作工藝研究，重點突破瞭層壓與共燒工藝，將LTCC基闆平麵呎吋的燒結收縮率不均勻度由通常的±0.3%~±0.4%減小到小于±0.04%，可以較好地滿足高密度高頻MCM研製的需要。
LTCC기판적공소수축균균성수도재료화가공공예적영향교대，사소성기판적평면척촌난이정학공제，성위LTCC기판실현고성능응용적일대장애，수요중점돌파。문장재간요개소료상견평면령수축LTCC기판제작공예기술적기출상，통과정선LTCC생자대병설계10층화20층LTCC호련실험기판，제출평개지표，근거자유조건개전료자약속소결평면령수축LTCC기판적제작공예연구，중점돌파료층압여공소공예，장LTCC기판평면척촌적소결수축솔불균균도유통상적±0.3%~±0.4%감소도소우±0.04%，가이교호지만족고밀도고빈MCM연제적수요。
Because the co-firing shrink uniformity of LTCC substrate is largely affected by material and manufacturing process, it makes the precision control of the co-fired substrate plane dimensions very difficult, and that becomes a major obstacle of LTCC substrate in high performance applications, so it need to be broken through. This paper introduced several common plane zero-shrink LTCC substrate manufacturing technologies briefly, and by sensible selection of LTCC tape, designing 10 and 20 layer LTCC connecting test substrates, and putting forward the evaluation pass standard, it carried out the study of self-constraint sintering plane zero-shrink LTCC substrate manufacturing process on ourselves facilities, and stressly broke through the processes of laminating and co-firing. It reduced the firing shrinkage disuniformities of X and Y dimensions of LTCC substrate to less than ±0.04%from the ordinary ±0.3%~±0.4%, and that will meet the requirements of developing high density and high frequency MCM quite well.
