CAJ | 학술논문

蚀刻法是埋嵌电容技术中研究与应用较多的方法。文章研究了双面蚀刻一次层压与单面蚀刻两次层压这两种工艺方法，并指出了两种方法加工埋嵌电容PCB工艺过程的关键点。通过电容值测量及回流焊测试，对比分析了不同工艺方法对埋嵌电容PCB的容值精确度及耐热性能的影响，明确了这两种工艺方法的优缺点。
식각법시매감전용기술중연구여응용교다적방법。문장연구료쌍면식각일차층압여단면식각량차층압저량충공예방법，병지출료량충방법가공매감전용PCB공예과정적관건점。통과전용치측량급회류한측시，대비분석료불동공예방법대매감전용PCB적용치정학도급내열성능적영향，명학료저량충공예방법적우결점。
Etching methods is extensive studied and used in producing embedded capacitor PCB. Two kinds of etching methods as the double-sided etching with one lamination process and the single-sided etching with two lamination process were studied in this paper. The key points in processing embedded capacitor PCB were also pointed out. The capacitance measuring and the reflow test were adopted for comparative analysis in capacitance value accuracy and heat-resistant properties of the different methods. And the advantages and disadvantages of these two methods were made clear.