电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
11期
5-7
,共3页
单厚度%锡层控制%应力作用%针孔%拉筋%绝缘测试
單厚度%錫層控製%應力作用%針孔%拉觔%絕緣測試
단후도%석층공제%응력작용%침공%랍근%절연측시
single gage%solder thickness%stressed%pinhole%tendon pull%ISO test
文章通过分析对比TO-220FS封装产品内部与传统全包封产品内部结构的差异性,来展现产品的生产、工艺流程中的各技术难点。然后通过对各技术难点进行成因分析并采取相对应的解决方案,使技术难关得到顺利攻克。该过程所攻克的技术要点包括工艺条件、工艺技术、设备改造,解决了粘晶过程的锡层控制、焊线过程消除应力作用、塑封针孔、去料道、剪切拉筋、绝缘测试等问题,顺利地实现了批量生产,装配后产品技术指示能满足市场要求,产品质量稳定。
文章通過分析對比TO-220FS封裝產品內部與傳統全包封產品內部結構的差異性,來展現產品的生產、工藝流程中的各技術難點。然後通過對各技術難點進行成因分析併採取相對應的解決方案,使技術難關得到順利攻剋。該過程所攻剋的技術要點包括工藝條件、工藝技術、設備改造,解決瞭粘晶過程的錫層控製、銲線過程消除應力作用、塑封針孔、去料道、剪切拉觔、絕緣測試等問題,順利地實現瞭批量生產,裝配後產品技術指示能滿足市場要求,產品質量穩定。
문장통과분석대비TO-220FS봉장산품내부여전통전포봉산품내부결구적차이성,래전현산품적생산、공예류정중적각기술난점。연후통과대각기술난점진행성인분석병채취상대응적해결방안,사기술난관득도순리공극。해과정소공극적기술요점포괄공예조건、공예기술、설비개조,해결료점정과정적석층공제、한선과정소제응력작용、소봉침공、거료도、전절랍근、절연측시등문제,순리지실현료비량생산,장배후산품기술지시능만족시장요구,산품질량은정。
This paper shows the dififculties of production, process the various technical by analyzing and contrasting the difference of the internal structure between the TO-220FS package and general product. And then by analyzing the causes of technical difficulties and taking the corresponding solutions, the technical difficulties are overcome smoothly. The process including process conditions, technology, equipment modiifcation, solve the problem of solder thickness control, eliminate stress in wire process, plastic pinhole, drunker, tendon pull in trimming process, isolation testing etc, the mass production successfully achieved.