电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
11期
1-4
,共4页
无铅钎料%软钎焊%SAC305%铺展
無鉛釬料%軟釬銲%SAC305%鋪展
무연천료%연천한%SAC305%포전
Pb-free solder%soldering%wetting%SAC305%spreading
文章阐述了钎料润湿的基本原理，分析了关键工艺参数对钎料铺展性能的影响规律。针对温度、时间和表面状态等关键参数/状态，对无铅钎料SAC305在Au/Ni镀层上的铺展性能开展试验研究。结果表明，随着焊接温度和保温时间的增加，无铅钎料SAC305的铺展性能明显改善，铺展系数逐渐趋于100%。同时，通过RF的Ar等离子对钎料进行表面预处理也能够使其铺展性能有所改善。试验结果与理论分析具有较好的一致性。
文章闡述瞭釬料潤濕的基本原理，分析瞭關鍵工藝參數對釬料鋪展性能的影響規律。針對溫度、時間和錶麵狀態等關鍵參數/狀態，對無鉛釬料SAC305在Au/Ni鍍層上的鋪展性能開展試驗研究。結果錶明，隨著銲接溫度和保溫時間的增加，無鉛釬料SAC305的鋪展性能明顯改善，鋪展繫數逐漸趨于100%。同時，通過RF的Ar等離子對釬料進行錶麵預處理也能夠使其鋪展性能有所改善。試驗結果與理論分析具有較好的一緻性。
문장천술료천료윤습적기본원리，분석료관건공예삼수대천료포전성능적영향규률。침대온도、시간화표면상태등관건삼수/상태，대무연천료SAC305재Au/Ni도층상적포전성능개전시험연구。결과표명，수착한접온도화보온시간적증가，무연천료SAC305적포전성능명현개선，포전계수축점추우100%。동시，통과RF적Ar등리자대천료진행표면예처리야능구사기포전성능유소개선。시험결과여이론분석구유교호적일치성。
The principle of wetting between solder and coating was introduced, and the influence of key parameters on spreading properties of solder was analyzed. In order to elucidate the relations between processing parameters, such as soldering temperature, time and surface texture, and the spreading properties between SAC305 Pb-free solder and Au/Ni metallization have been experimentally studied. The results shown that the spreading properties of SAC305 were improved with soldering temperature and time increasing, and the spreading coefifcient approached to 100%gradually. The spreading properties also can be improved appreciably by RF Ar plasma treatment. The experimental results were good agreed with the principle analyses.
