CAJ | 학술논문

提出了铁氧体薄膜器件光刻多次涂胶新工艺，研究了涂覆次数对光刻胶的表面粗糙度、均匀性和厚度的影响。同时结合培烘试验，对一种实际电路基片进行了验证。试验结果表明：随着光刻胶涂覆次数的增加，光刻胶厚度逐渐增大，增加幅度逐渐减小，涂覆光刻胶的表面粗糙度有明显改善，均匀性也逐渐提高。当烘焙温度为50℃、烘焙时间为25min，光刻胶与基底的附着力、感光性和耐腐蚀性均能满足铁氧体器件薄膜电路制作工艺的要求。利用多次涂胶法可有效去除电路手工修补工艺，从而提高铁氧体薄膜器件的电路图形加工质量及效率。
제출료철양체박막기건광각다차도효신공예，연구료도복차수대광각효적표면조조도、균균성화후도적영향。동시결합배홍시험，대일충실제전로기편진행료험증。시험결과표명：수착광각효도복차수적증가，광각효후도축점증대，증가폭도축점감소，도복광각효적표면조조도유명현개선，균균성야축점제고。당홍배온도위50℃、홍배시간위25min，광각효여기저적부착력、감광성화내부식성균능만족철양체기건박막전로제작공예적요구。이용다차도효법가유효거제전로수공수보공예，종이제고철양체박막기건적전로도형가공질량급효솔。
Multiple spin-coating technology was proposed for ferrite film device lithograph, and influence of coating times on the surface rougnness, uniformity and thickness of photo-resist was investigated. At the same time, baking test was conducted on a practical circuit substrate. The experimental results show that, with increasing the number of coating photo-resist, the thickness of photo-resist increases, with a decreased increase amplitude, and both surface roughness and uniformity of photo-resist is improved obviously. When baking at 50℃for 25min, photo-resist adherence to the substrate, photo-sensitivity, and corrosion-resistance of the photo-resist can meet the requirements of thin film circuit production process of ferrite devices. The use of multiple coating can omit circuit manual repairing, resultantly improving the quality and efficiency of the circuit graphics processing of ferrite thin film devices.