电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
12期
20-22,38
,共4页
塑封%双极器件%HFE%高压蒸汽
塑封%雙極器件%HFE%高壓蒸汽
소봉%쌍겁기건%HFE%고압증기
power factor correction%boost convert%L6563 control chip
塑封双极晶体管采用EIA/JESD22-A102-C规定的121℃、100％RH、29.7 psi压力的条件试验96 h后，测试发现直流增益HFE会有明显的下降，击穿电压BVCEO会略有上升。开封芯片检查和理论分析表明，高压水汽可以穿透封装，造成芯片内部微缺陷增加，导致器件HFE下降，BVCEO略有上升。通过优化封装材料及工艺，可以改善HFE漂移，增强器件抗潮湿性能。
塑封雙極晶體管採用EIA/JESD22-A102-C規定的121℃、100％RH、29.7 psi壓力的條件試驗96 h後，測試髮現直流增益HFE會有明顯的下降，擊穿電壓BVCEO會略有上升。開封芯片檢查和理論分析錶明，高壓水汽可以穿透封裝，造成芯片內部微缺陷增加，導緻器件HFE下降，BVCEO略有上升。通過優化封裝材料及工藝，可以改善HFE漂移，增彊器件抗潮濕性能。
소봉쌍겁정체관채용EIA/JESD22-A102-C규정적121℃、100％RH、29.7 psi압력적조건시험96 h후，측시발현직류증익HFE회유명현적하강，격천전압BVCEO회략유상승。개봉심편검사화이론분석표명，고압수기가이천투봉장，조성심편내부미결함증가，도치기건HFE하강，BVCEO략유상승。통과우화봉장재료급공예，가이개선HFE표이，증강기건항조습성능。
Most modern electronic equipment using switch-mode power supply, they will produce undesirable current harmonics, these harmonics had a negative impact on the quality of power supply and other devices connected to the power system. This paper introduces the active power factor correction circuit principle and propose an active power factor correction circuit based on L6563. The experiment show that, The boost power factor correction circuit design is reasonable, reliable performance, power factor reaches 0.99, which can effectively improve the power quality.
