CAJ | 학술논문

引线键合是多芯片微波组件微组装中常用的工艺，通常都会以一定拱弧实现芯片与基板、基板与基板间的互连。如何进行拱高的测量和控制对引线键合有着重要意义，因为拱高的大小还会对微波性能产生重要的影响。文中利用自动键合机获得若干组引线，采用光学测量方法，在放大40倍的状态下分别进行了不同工艺参数下的拱高测量，得出结论在测试范围内，拱度随着弧长的增加而增加，同时还获得了一组适用于微波应用的键合参数。
인선건합시다심편미파조건미조장중상용적공예，통상도회이일정공호실현심편여기판、기판여기판간적호련。여하진행공고적측량화공제대인선건합유착중요의의，인위공고적대소환회대미파성능산생중요적영향。문중이용자동건합궤획득약간조인선，채용광학측량방법，재방대40배적상태하분별진행료불동공예삼수하적공고측량，득출결론재측시범위내，공도수착호장적증가이증가，동시환획득료일조괄용우미파응용적건합삼수。
Wire bonding process is widely used in microwave multi-chip module for joining chip to substrate or substrate to substrate with given curve, which the highest point to substrate named as bond height. It is valuable to develop bond height measure and control of wire bonding because it has important effects on microwave performance. In this article, groups of wires done with automatic bonding machine is optical measured by zooming in 40 times, then bond height increases with wire length by the test, meanwhile, a group of parameters is gained for assembly in microwave multi-chip module.