CAJ | 학술논문

阐述了高速、高性能集成电路所需高密度、高可靠的表面贴装型陶瓷封装，讨论了多层高温共烧陶瓷工艺如何设计与塑料封装QFN完全兼容，结合0.50 mm节距CQFN72外壳设计，就如何解决CQFN封装的散热、高频电性能、薄型封装的气密性和结构强度，以及封装电路的二次组装中助焊剂清洗不彻底、焊接层/焊点有空洞和桥连短路、焊点难检查和返工困难等问题进行了论述，为高密度、高性能、高可靠封装提供了新的封装结构和技术途径。
천술료고속、고성능집성전로소수고밀도、고가고적표면첩장형도자봉장，토론료다층고온공소도자공예여하설계여소료봉장QFN완전겸용，결합0.50 mm절거CQFN72외각설계，취여하해결CQFN봉장적산열、고빈전성능、박형봉장적기밀성화결구강도，이급봉장전로적이차조장중조한제청세불철저、한접층/한점유공동화교련단로、한점난검사화반공곤난등문제진행료논술，위고밀도、고성능、고가고봉장제공료신적봉장결구화기술도경。
Describes a high-speed, high-performance IC require high reliability high-density surface mount ceramic package, this paper discusses the multi-layer high-temperature co-fired ceramic technology to design CQFN compatible with plastic QFN, combined with 0.50 mm pitch CQFN72 design, on how to resolve CQFN package thermal conductivity, high-frequency electrical properties,thin package hermetic and tstructural strength, and IC assembly flux cleaning, solder layer voids or bridging, solder joint inspection and rework difficulties are discussed. For high-density, high-performance, high reliable package provides a new package structure, a new technical approach.