电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2012年
4期
1-3,19
,共4页
胡骏%雷党刚%金家富%付娟
鬍駿%雷黨剛%金傢富%付娟
호준%뢰당강%금가부%부연
一体化管壳%平行缝焊%焊接应力%有限元法
一體化管殼%平行縫銲%銲接應力%有限元法
일체화관각%평행봉한%한접응력%유한원법
integral substrate/package%parallel seam sealing%stress of welding%finite element method
微小型一体化管壳将基板和外壳构成一个封装整体,可以较好地解决高密度集成微电路的封装难题。平行缝焊技术是微小型一体化管壳气密封装的主要形式,平行缝焊的热应力是造成微小型一体化管壳气密封装失效的主要原因。文章用有限元法计算了微小型一体化管壳的热应力分布,并在此基础上优化了平行缝焊参数,保证获得最佳的焊接效果。
微小型一體化管殼將基闆和外殼構成一箇封裝整體,可以較好地解決高密度集成微電路的封裝難題。平行縫銲技術是微小型一體化管殼氣密封裝的主要形式,平行縫銲的熱應力是造成微小型一體化管殼氣密封裝失效的主要原因。文章用有限元法計算瞭微小型一體化管殼的熱應力分佈,併在此基礎上優化瞭平行縫銲參數,保證穫得最佳的銲接效果。
미소형일체화관각장기판화외각구성일개봉장정체,가이교호지해결고밀도집성미전로적봉장난제。평행봉한기술시미소형일체화관각기밀봉장적주요형식,평행봉한적열응력시조성미소형일체화관각기밀봉장실효적주요원인。문장용유한원법계산료미소형일체화관각적열응력분포,병재차기출상우화료평행봉한삼수,보증획득최가적한접효과。
The micro integral substrate/package integrated the substrate with the package,which can solve the package problem for the high density and high integration microcircuit.The Parallel seam sealing was a method that we sealed the micro integral substrate/package.The stress of welding of the micro integral substrate/package mainly affected the reliability of the package.The stress of the package was calculated by the finite element method.On this basis,we optimized the parameters of the parallel seam sealing,so we can achieve the best effect of the parallel sealing.
