现代电子技术
現代電子技術
현대전자기술
MODERN ELECTRONICS TECHNIQUE
2014年
12期
143-147
,共5页
散热过孔%导热率%镀铜厚度%热仿真
散熱過孔%導熱率%鍍銅厚度%熱倣真
산열과공%도열솔%도동후도%열방진
via hole%thermal conductivity%copper plating thickness%thermal simulation
为了对电源设备的印刷电路板（PCB）散热过孔的导热性能做优化提高，推导了一套理论计算公式，采用数值仿真、实验测试的方法验证了该公式的可靠性。通过该理论计算公式，研究了散热过孔的孔径、填充的材料以及过孔镀铜厚度对导热率的影响。研究结果显示，过孔内孔直径为0.45 mm为最优直径；填充材料为FR4或者Rogers时没有明显的改善，但是如果用焊锡等高导热率的材质填充时导热率有明显的提高；过孔镀层厚度对导热率的影响非常大，呈线性的增长关系。采用该结果推荐的三种散热过孔优化方案，能使导热率分别提高6.5%，35%及51%。
為瞭對電源設備的印刷電路闆（PCB）散熱過孔的導熱性能做優化提高，推導瞭一套理論計算公式，採用數值倣真、實驗測試的方法驗證瞭該公式的可靠性。通過該理論計算公式，研究瞭散熱過孔的孔徑、填充的材料以及過孔鍍銅厚度對導熱率的影響。研究結果顯示，過孔內孔直徑為0.45 mm為最優直徑；填充材料為FR4或者Rogers時沒有明顯的改善，但是如果用銲錫等高導熱率的材質填充時導熱率有明顯的提高；過孔鍍層厚度對導熱率的影響非常大，呈線性的增長關繫。採用該結果推薦的三種散熱過孔優化方案，能使導熱率分彆提高6.5%，35%及51%。
위료대전원설비적인쇄전로판（PCB）산열과공적도열성능주우화제고，추도료일투이론계산공식，채용수치방진、실험측시적방법험증료해공식적가고성。통과해이론계산공식，연구료산열과공적공경、전충적재료이급과공도동후도대도열솔적영향。연구결과현시，과공내공직경위0.45 mm위최우직경；전충재료위FR4혹자Rogers시몰유명현적개선，단시여과용한석등고도열솔적재질전충시도열솔유명현적제고；과공도층후도대도열솔적영향비상대，정선성적증장관계。채용해결과추천적삼충산열과공우화방안，능사도열솔분별제고6.5%，35%급51%。
to enhance the thermal conductivity of via hole in PCB of electrical power units,a formula was deduced to calcu-late the thermal conductivity of via hole. This formula was verified by both numerical simulation and experiment. With the formu-la,the impacts of via hole diameter,filling material and copper plating thickness on thermal conductivity are studied in this pa-per. The conclusions are that via hole diameter of 0.45 mm is the best value;FR4 or Rogers;filling material of the via hole can get minor benefit on thermal conductivity,but if filling with high conductivity material such as solder,the thermal conductivity is improved obviously;the plating layer thickness of via hole impacts the thermal conductivity most,which appears a liner growth relationship between the thickness and the conductivity. With the three recommend optimization methods,the thermal conductivity of via hole can increase by 6.5%,35% and 51% respectively.
