兵器材料科学与工程
兵器材料科學與工程
병기재료과학여공정
Ordnance Material Science and Engineering
2013年
6期
10-13,14
,共5页
硅烯%剪切性能%分子动力学%温度
硅烯%剪切性能%分子動力學%溫度
규희%전절성능%분자동역학%온도
silicene%shear properties%molecular dynamics%temperature
采用Tersoff势对硅烯薄膜剪切破坏过程进行分子动力学模拟，研究了不同温度对锯齿型和扶手椅型硅烯薄膜剪切力学特性的影响，得到相应的应力-应变曲线关系以及剪切破坏形态。结果表明，硅烯薄膜的剪切模量、剪切强度和极限剪切应变随温度增加均明显下降。
採用Tersoff勢對硅烯薄膜剪切破壞過程進行分子動力學模擬，研究瞭不同溫度對鋸齒型和扶手椅型硅烯薄膜剪切力學特性的影響，得到相應的應力-應變麯線關繫以及剪切破壞形態。結果錶明，硅烯薄膜的剪切模量、剪切彊度和極限剪切應變隨溫度增加均明顯下降。
채용Tersoff세대규희박막전절파배과정진행분자동역학모의，연구료불동온도대거치형화부수의형규희박막전절역학특성적영향，득도상응적응력-응변곡선관계이급전절파배형태。결과표명，규희박막적전절모량、전절강도화겁한전절응변수온도증가균명현하강。
The failure process of silicene sheets under shear deformation was simulated by molecular dynamics method with Tersoff potential. The temperature effects on the shear properties of zigzag and armchair silicene sheets were analyzed,and corresponding stress-strain relationships and shear failure modes were obtained. The results indicate that the shear modulus,the shear strength and limit shear strain of silicene are significantly reduced with the increase of temperature.
