电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
12期
33-39
,共7页
金丝球焊%凸点制作%工艺参数
金絲毬銲%凸點製作%工藝參數
금사구한%철점제작%공예삼수
Gold wire bonding%Bump bonding%Process parameters
介绍了金丝球焊制作焊接凸点的过程和工艺参数。通过实验优化了凸点高度、尾线长度、超声功率、超声时间、焊接压力、热台温度等工艺参数，得到一致性好、焊接性能稳定的焊接参数。
介紹瞭金絲毬銲製作銲接凸點的過程和工藝參數。通過實驗優化瞭凸點高度、尾線長度、超聲功率、超聲時間、銲接壓力、熱檯溫度等工藝參數，得到一緻性好、銲接性能穩定的銲接參數。
개소료금사구한제작한접철점적과정화공예삼수。통과실험우화료철점고도、미선장도、초성공솔、초성시간、한접압력、열태온도등공예삼수，득도일치성호、한접성능은정적한접삼수。
The paper introducesthe chip bumping process by gold wire ball bonding and Welding process parameter. At last we get the best process parameters of chip bump which has good consistency and stablewelding capability by the .optimized parameter experiments, just like the bump height, taillength, ultrasonicpower, ultrasonic time, the pressure of welding, table heating temperature, for bumpbonding.
