一种高功率光纤耦合半导体激光器无水冷封装模块封装方法
일충고공솔광섬우합반도체격광기무수랭봉장모괴봉장방법
A encapsulation method of high power and fiber coupling semiconductor laser uncooled packaging module
  • 万方数据
    科技创新导报 과기창신도보
    SCIENCE AND TECHNOLOGY CONSULTING HERALD
    2012年 30期 44-45 ,共2页

    庞勇%张剑家%吴勇%魏冬寒%韩凯

    방용%장검가%오용%위동한%한개

    无水冷%封装模块%封装技术 無水冷%封裝模塊%封裝技術
    무수랭%봉장모괴%봉장기술
    uncooled%package module%packaging technology
    无水冷封装技术在大功率,小体积,低功耗等方面呈现的发展潜力,使无制冷封装技术成为急待突破的核心技术。提供一种实现半导体激光器高功率光纤耦合输出的设计,并重点介绍了无水冷封装模块的封装方法。
    무수랭봉장기술재대공솔,소체적,저공모등방면정현적발전잠력,사무제랭봉장기술성위급대돌파적핵심기술。제공일충실현반도체격광기고공솔광섬우합수출적설계,병중점개소료무수랭봉장모괴적봉장방법。
    Uncooled packaging technology are very attractive in highpower, small size, low power consumption.And it have been the key technology to be solved.Provides a design of semiconductor laser which can realize high power and fiber coupling output.Especially introduce the uncooled packaging technology.
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