CAJ | 학술논문

随着绝缘栅双极型晶体管等功率器件的发展，对陶瓷敷铜基板（DBC）的需求越来越大。分别介绍了DBC基板的种类、结构，预氧化工艺对DBC基板的影响和敷接机理。用扫描电镜、X射线衍射等分析手段确定铜箔表面氧化后的物相成份，用X射线扫描确定敷接后界面空洞，并分析产生空洞的原因。用SEM观察界面的形貌并进行断面分析，用XRD和X-RAY分析界面产物的物相成份，从而确定DBC基板的敷接机理。
수착절연책쌍겁형정체관등공솔기건적발전，대도자부동기판（DBC）적수구월래월대。분별개소료DBC기판적충류、결구，예양화공예대DBC기판적영향화부접궤리。용소묘전경、X사선연사등분석수단학정동박표면양화후적물상성빈，용X사선소묘학정부접후계면공동，병분석산생공동적원인。용SEM관찰계면적형모병진행단면분석，용XRD화X-RAY분석계면산물적물상성빈，종이학정DBC기판적부접궤리。
With the development of IGBT and power device, there is a higher demand for DBC. The article respectively describes the DBC category and structure, the affection the preformed oxidation to DBC and the bonding mechanism. The surface composition of the copper is confirmed by SEM and XRD, the void is conifrmed by X-ray, the paper also analyzed the causation to produce the void. The paper analyses morphology and section of the inter phase by SEM, and analyses the inter phase composition by XRD and X-RAY. The bonding mechanism is conifrmed.