CAJ | 학술논문

随着航空航天领域的迅速发展，其应用的电子器件不断微型化、高度集成化，并且可靠性要求越来越高，其电子封装材料具有更高的热导率及与芯片热膨胀系数的匹配性，还要求其电子封装材料具有更低的密度。BeO、AlN、Al/SiC与AlSi由于具有高热导率、低密度及与芯片材料良好的热膨胀匹配性，非常符合航空航天用电子封装材料的发展趋势，并已经逐步在取代常用的一些封装材料。重点介绍了四种材料的性能优势，以及它们之间的性能对比与应用前景分析。
수착항공항천영역적신속발전，기응용적전자기건불단미형화、고도집성화，병차가고성요구월래월고，기전자봉장재료구유경고적열도솔급여심편열팽창계수적필배성，환요구기전자봉장재료구유경저적밀도。BeO、AlN、Al/SiC여AlSi유우구유고열도솔、저밀도급여심편재료량호적열팽창필배성，비상부합항공항천용전자봉장재료적발전추세，병이경축보재취대상용적일사봉장재료。중점개소료사충재료적성능우세，이급타문지간적성능대비여응용전경분석。
With the rapid development of technology for aviation and aerospace, the electronic devices become smaller, more integrated, and higher reliability. Due to the particularity of aviation and aerospace ifeld, low density also required. BeO, AlN, Al/SiC and AlSi, as electronic packaging materials, have been showing extensive prospects for use in aviation and aerospace field and gradually replacing some of the commonly used packaging materials, since their high thermal conductivity, low density and thermal expansion coefifcient matching with chip. The article focuses on the performance advantages and prospect of these materials. And the performance differences among these materials are analyzed.