CAJ | 학술논문

SiP是实现先进电子设备小型化、多功能化和高可靠性的有效途径。SiP的组装和封装载体是基板。LTCC通过采用更小的通孔直径、更细的线宽/线间距和更多的布线层数能实现SiP复杂系统大容量的布线。通过采用空腔结构可以优化系统元器件的组装，提高散热能力。利用埋置无源元件，可以减少SiP表贴元件的数量。利用3D-MCM和一体化封装可以进一步减少系统的面积和体积，缩短互连线。未来SiP的发展要求LTCC具有更好的散热能力、更高的基板制作精度和更多无源元件的集成。
SiP시실현선진전자설비소형화、다공능화화고가고성적유효도경。SiP적조장화봉장재체시기판。LTCC통과채용경소적통공직경、경세적선관/선간거화경다적포선층수능실현SiP복잡계통대용량적포선。통과채용공강결구가이우화계통원기건적조장，제고산열능력。이용매치무원원건，가이감소SiP표첩원건적수량。이용3D-MCM화일체화봉장가이진일보감소계통적면적화체적，축단호련선。미래SiP적발전요구LTCC구유경호적산열능력、경고적기판제작정도화경다무원원건적집성。
SiP is an effective route to realize miniaturization, multifunction and high reliability of advanced electronic facilities. Assembly and packaging for SiP bases on substrate. By using lesser vias, more ifne line/line gap and more layer, LTCC can easily carry off the large capacity wiring for complex system. Assembly site of some SiP components can be optimized and heat disSiPation ability is higher by using LTCC cavities for SiP. LTCC can cut down the components mounted on substrate surface by embedding passive components, raises packing density and reliability for SiP. By means of LTCC 3D-MCM and integrated packaging, the system projected area and volume can be reduced further, the interconnection line can be shortened. It need good heat radiation, higher production precision and more integrated passive components for LTCC to meet SiP development.