绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2013年
4期
67-69
,共3页
何玉汝%戴培邦%卢悦群%许积文%王华
何玉汝%戴培邦%盧悅群%許積文%王華
하옥여%대배방%로열군%허적문%왕화
甲基丙烯酸丁酯%聚醚酰亚胺%反应共混%阻变存储性能
甲基丙烯痠丁酯%聚醚酰亞胺%反應共混%阻變存儲性能
갑기병희산정지%취미선아알%반응공혼%조변존저성능
butyl methacrylate%polyetherimide%reactive blending%resistive switching characteristics
将甲基丙烯酸丁酯(BMA)与聚醚酰亚胺(PEI)溶液混合,通过自由基聚合得到聚甲基丙烯酸丁酯/聚醚酰亚胺共混高分子体系(PBMA/PEI);将PBMA/PEI作为有机功能层制备三明治结构的阻变存储器件ITO/(PBMA/PEI)/Ag,对PBMA/PEI进行结构表征,分析其热性能和ITO/(PBMA/PEI)/Ag的阻变性能。结果表明:制备的PBMA/PEI具有良好的耐热性能,其初始分解温度为250℃;制备的阻变存储器件具有较好的阻变存储特性,即较高的电流开关比(106)、较低的跳变电压(1.8 V)、较低的开态电流(约为10-4 A)。
將甲基丙烯痠丁酯(BMA)與聚醚酰亞胺(PEI)溶液混閤,通過自由基聚閤得到聚甲基丙烯痠丁酯/聚醚酰亞胺共混高分子體繫(PBMA/PEI);將PBMA/PEI作為有機功能層製備三明治結構的阻變存儲器件ITO/(PBMA/PEI)/Ag,對PBMA/PEI進行結構錶徵,分析其熱性能和ITO/(PBMA/PEI)/Ag的阻變性能。結果錶明:製備的PBMA/PEI具有良好的耐熱性能,其初始分解溫度為250℃;製備的阻變存儲器件具有較好的阻變存儲特性,即較高的電流開關比(106)、較低的跳變電壓(1.8 V)、較低的開態電流(約為10-4 A)。
장갑기병희산정지(BMA)여취미선아알(PEI)용액혼합,통과자유기취합득도취갑기병희산정지/취미선아알공혼고분자체계(PBMA/PEI);장PBMA/PEI작위유궤공능층제비삼명치결구적조변존저기건ITO/(PBMA/PEI)/Ag,대PBMA/PEI진행결구표정,분석기열성능화ITO/(PBMA/PEI)/Ag적조변성능。결과표명:제비적PBMA/PEI구유량호적내열성능,기초시분해온도위250℃;제비적조변존저기건구유교호적조변존저특성,즉교고적전류개관비(106)、교저적도변전압(1.8 V)、교저적개태전류(약위10-4 A)。
A poly(butyl methacrylate)(PBMA)/polyetherimide(PEI) blending polymer was synthesized by rad-ical polymerization from butyl methacrylate(BMA) and polyetherimide solution, and a sandwich structure resistive random access memory ITO/(PBMA/PEI)/Ag was prepared using PBMA/PEI as organic function layer. The structure of the PBMA/PEI was characterized and the heat-resistance and resistive switching characteristics of the ITO/(PBMA/PEI)/Ag were studied. The results show that the PBMA/PEI has good heat-resistance, with the initial decomposition temperature of 250℃. The resistive random access memory has good resistive switching characteristics, that means higher Ion/Ioff ratio(106), lower switching threshold voltage (1.8 V) and lower on-current (about 10-4 A).