CAJ | 학술논문

　　采用粒径为400 nm的纳米级氮化铝对聚酰亚胺进行填充，制备了纳米氮化铝增强的聚酰亚胺基覆铜板，研究了纳米氮化铝含量对聚酰亚胺膜及聚酰亚胺基覆铜板各项性能的影响。结果表明：随着纳米氮化铝含量的增加，聚酰亚胺膜的热导率、热稳定性相应增加，而断裂延伸率及其与铜箔之间的剥离强度则大幅下降。当纳米氮化铝的含量为40%时，聚酰亚胺膜基覆铜板的综合性能最佳。
　　채용립경위400 nm적납미급담화려대취선아알진행전충，제비료납미담화려증강적취선아알기복동판，연구료납미담화려함량대취선아알막급취선아알기복동판각항성능적영향。결과표명：수착납미담화려함량적증가，취선아알막적열도솔、열은정성상응증가，이단렬연신솔급기여동박지간적박리강도칙대폭하강。당납미담화려적함량위40%시，취선아알막기복동판적종합성능최가。
A polyimide based copper clad laminate was prepared by filling 400nm size aluminum nitride to poly-imide, and the effects of nano aluminum nitride content on the various properties of the polyimide film and polyimide based copper clad laminate were studied. The results show that with the increase of nano aluminum nitride content, the thermal conductivity and thermal stability of the PI film increase, and the elongation at break of the PI film and the peel strength between PI film and copper foil decrease greatly. When the nano alu-minum nitride content is 40%, the polyimide based copper clad laminate has the best comprehensive properties.