CAJ | 학술논문

研究Sb元素含量对Sn-Bi系焊料性能的影响。通过差示扫描量热法研究Sn-Bi-Sb焊料的熔化行为。采用铺展实验研究焊料在Cu基板上的润湿性。测试Sn-Bi-Sb/Cu结合界面的力学性能。结果表明：三元合金中含有包共晶反应形成的共晶组织，随着Sb含量的增加，共晶组织增多；在加热速率为5°C/min的条件下，三元合金显示出更高的熔点和更宽的熔程；添加少量Sb对Sb-Bi系焊料的铺展率有影响；在焊料铺展过程中形成反应过渡层，反应过渡层中存在Sb元素而无Bi元素，过渡层厚度随着Sb元素含量的增加而增大。Sn-Bi-Sb焊料的剪切强度随着Sb元素含量的增加而升高。
연구Sb원소함량대Sn-Bi계한료성능적영향。통과차시소묘량열법연구Sn-Bi-Sb한료적용화행위。채용포전실험연구한료재Cu기판상적윤습성。측시Sn-Bi-Sb/Cu결합계면적역학성능。결과표명：삼원합금중함유포공정반응형성적공정조직，수착Sb함량적증가，공정조직증다；재가열속솔위5°C/min적조건하，삼원합금현시출경고적용점화경관적용정；첨가소량Sb대Sb-Bi계한료적포전솔유영향；재한료포전과정중형성반응과도층，반응과도층중존재Sb원소이무Bi원소，과도층후도수착Sb원소함량적증가이증대。Sn-Bi-Sb한료적전절강도수착Sb원소함량적증가이승고。
The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry (DSC). The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 °C/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.