印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
1期
45-49
,共5页
信号完整性%高速数字电路%盲孔%埋孔
信號完整性%高速數字電路%盲孔%埋孔
신호완정성%고속수자전로%맹공%매공
High-Speed Digital Circuit%Blind Via%Buried Via%Signal Integrity
在高速数字电路中，随着系统工作频率的提高和数字信号上升沿的变陡，多层印制电路板中的盲埋孔带来的阻抗不连续性会引起信号的反射，严重影响到系统的信号特性。因此，盲埋孔的设计正逐渐成为制约高速PCB设计的关键因素之一。本文运用全波电磁仿真软件HFSS，对多层PCB板盲埋孔结构建模仿真，将盲埋孔与导通孔进行比较，分析盲埋孔孔径、焊盘、反焊盘几种关键参数对信号特性的影响。
在高速數字電路中，隨著繫統工作頻率的提高和數字信號上升沿的變陡，多層印製電路闆中的盲埋孔帶來的阻抗不連續性會引起信號的反射，嚴重影響到繫統的信號特性。因此，盲埋孔的設計正逐漸成為製約高速PCB設計的關鍵因素之一。本文運用全波電磁倣真軟件HFSS，對多層PCB闆盲埋孔結構建模倣真，將盲埋孔與導通孔進行比較，分析盲埋孔孔徑、銲盤、反銲盤幾種關鍵參數對信號特性的影響。
재고속수자전로중，수착계통공작빈솔적제고화수자신호상승연적변두，다층인제전로판중적맹매공대래적조항불련속성회인기신호적반사，엄중영향도계통적신호특성。인차，맹매공적설계정축점성위제약고속PCB설계적관건인소지일。본문운용전파전자방진연건HFSS，대다층PCB판맹매공결구건모방진，장맹매공여도통공진행비교，분석맹매공공경、한반、반한반궤충관건삼수대신호특성적영향。
As the operating frequency increases and signal rise time reduces, Blind via and buried via cause impedance discontinuities resulting in signal refiections and hence deterioration of system performance in the multi-layers PCB design. So the design of blind via and buried via has been the one of key factors of the high-speed digital circuit. The paper carries out a study of blind via and buried via structure in multi-layers PCBs by modeling and simulation, using a full-wave electromagnetic simulator, and comparing with the through via, analyzes the impact of blind via and buried via diameter, pad and anti-pad on signal property.
