电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2014年
1期
49-51
,共3页
低温共烧陶瓷%砂轮划片%背面崩边
低溫共燒陶瓷%砂輪劃片%揹麵崩邊
저온공소도자%사륜화편%배면붕변
LTCC%Grinding wheel dicing%Back side collapse
通过正交试验确认了导致LTCC（低温共烧陶瓷）基板砂轮划片背面崩边的主要因素，基于对各个主要因素的分析，优化了砂轮划片方案，有效地解决了背面崩边问题，获得了高质量的划片效果。
通過正交試驗確認瞭導緻LTCC（低溫共燒陶瓷）基闆砂輪劃片揹麵崩邊的主要因素，基于對各箇主要因素的分析，優化瞭砂輪劃片方案，有效地解決瞭揹麵崩邊問題，穫得瞭高質量的劃片效果。
통과정교시험학인료도치LTCC（저온공소도자）기판사륜화편배면붕변적주요인소，기우대각개주요인소적분석，우화료사륜화편방안，유효지해결료배면붕변문제，획득료고질량적화편효과。
The main factors of collapse on LTCC substrate back side in dicing were recognised by using orthogonal experiment method. Based on the analysis results of the main factors, the plan for LTCC substrate dicing was optimized, by which the collapse problem was solved. High quality LTCC Substrate dicing was achieved at last.
