CAJ | 학술논문

激光软钎焊技术由于具有局部加热，快速加热，快速冷却等特点，更适合于微、小型电子元器件的“无铅化”组装，具有广阔的应用前景。通过查阅大量文献，综述了应用于软钎焊中各类激光器的特点，国内外激光软钎焊技术的研究现状等方面的内容，并对其在SM T 领域内的发展前景与方向做了简要的分析。
격광연천한기술유우구유국부가열，쾌속가열，쾌속냉각등특점，경괄합우미、소형전자원기건적“무연화”조장，구유엄활적응용전경。통과사열대량문헌，종술료응용우연천한중각류격광기적특점，국내외격광연천한기술적연구현상등방면적내용，병대기재SM T 영역내적발전전경여방향주료간요적분석。
Due to the characteristics of local heating, fast heating and fast cooling, laser soldering technology is more suitable for micro and small electronic com ponents "lead free" assem bly and has wide application foreground.Through consulting a number of literature materials,this paper overviews the characteristics of the various types of laser applied on soldering, domestic and foreign research status of laser soldering technology. It also makes a brief analysis on the developm ent prospects and direction of laser soldering on SMT .