电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2014年
1期
19-21,25
,共4页
无焊剂软钎焊%润湿铺展%还原气氛%等离子处理
無銲劑軟釬銲%潤濕鋪展%還原氣氛%等離子處理
무한제연천한%윤습포전%환원기분%등리자처리
Flux-free soldering%Wetting and Spreading%Reducing atmosphere%Plasma treatment
无焊剂软钎焊技术因其焊接过程中无焊剂残留，被广泛应用于光电器件和芯片倒装焊等方面。首先对无焊剂软钎焊的原理和工艺进行了阐述，并指出气氛保护和等离子处理是无焊剂软钎焊的两个主要技术途径。基于上述分析，采用无焊剂软钎焊工艺开展钎料润湿性研究。结果表明，还原气氛保护和等离子处理后，焊料的润湿铺展性能显著提高。
無銲劑軟釬銲技術因其銲接過程中無銲劑殘留，被廣汎應用于光電器件和芯片倒裝銲等方麵。首先對無銲劑軟釬銲的原理和工藝進行瞭闡述，併指齣氣氛保護和等離子處理是無銲劑軟釬銲的兩箇主要技術途徑。基于上述分析，採用無銲劑軟釬銲工藝開展釬料潤濕性研究。結果錶明，還原氣氛保護和等離子處理後，銲料的潤濕鋪展性能顯著提高。
무한제연천한기술인기한접과정중무한제잔류，피엄범응용우광전기건화심편도장한등방면。수선대무한제연천한적원리화공예진행료천술，병지출기분보호화등리자처리시무한제연천한적량개주요기술도경。기우상술분석，채용무한제연천한공예개전천료윤습성연구。결과표명，환원기분보호화등리자처리후，한료적윤습포전성능현저제고。
With the development of miniaturization, lightweight and integration in electronic packaging, interconnection space of microelectronic device have been decreased;meanwhile, the requirements of device’s reliability have been increased. For excellent electrical, mechanical and thermal properties, the solder joint become to one of the most important way in electronic packaging and interconnection. Because no flux residues in device, the flux-free soldering has been used in optoelectronic device and flip-chip widely. The principle and processing of flux-free soldering was introduced, and pointed out that the reducing atmosphere protection and plasma treatment was two main ways. Based on the above analysis, the wetting and spreading of solder was studied by flux-free soldering, the results shown that the wetting and spreading properties of soldering were improved by reducing atmosphere and plasma treatment during soldering.
