CAJ | 학술논문

自蔓延反应能在极短时间内产生足够集中的热量熔化钎料实现材料的连接，具有连接效率高、对连接母材热影响小等特点，从而在材料连接和电子封装领域有着广泛的应用前景。针对Cu/Cu和Cu/Si两种互连结构，建立Ai/Ni薄膜自蔓延反应的连接温度场有限元模型，分析不同钎料厚度、预热条件等参数以及不同连接材料对自蔓延反应连接温度场的影响规律。
자만연반응능재겁단시간내산생족구집중적열량용화천료실현재료적련접，구유련접효솔고、대련접모재열영향소등특점，종이재재료련접화전자봉장영역유착엄범적응용전경。침대Cu/Cu화Cu/Si량충호련결구，건립Ai/Ni박막자만연반응적련접온도장유한원모형，분석불동천료후도、예열조건등삼수이급불동련접재료대자만연반응련접온도장적영향규률。
Self-propagating reaction can produce concentrated heat in a very short period of time, which can melt solder and then achieve material connection. This heat source has high efficiency of connection and little heat effect on base material. Thus, self-propagating reaction connection method has widespread applications foreground for electronic packaging and material connection. Aim at Cu/Cu and Cu/Si interconnection structure, build finite element model of connection temperature field based on Al/Ni self-propagating reaction, and analyze influence rules of parameters such as different solder thickness or different preheating temperature and different connection material on temperature field of self-propagating reaction connection.