CAJ | 학술논문

对当前基于金属加工的电火花伺服控制系统在半导体电火花加工中失效的原因进行了分析。由于半导体加工中采样电压不再只是放电通道电压，而是由放电通道电压、半导体体电阻压降和接触势垒压降之和组成，使系统无法准确识别加工状态，导致无法进行准确的伺服进给。对进给速度与电流脉冲概率的关系进行了研究，提出了一种全新的基于电流脉冲概率的半导体电火花加工伺服控制方法，对相关系统参数进行了优化，最终实现了半导体电火花高效、精密、稳定加工。
대당전기우금속가공적전화화사복공제계통재반도체전화화가공중실효적원인진행료분석。유우반도체가공중채양전압불재지시방전통도전압，이시유방전통도전압、반도체체전조압강화접촉세루압강지화조성，사계통무법준학식별가공상태，도치무법진행준학적사복진급。대진급속도여전류맥충개솔적관계진행료연구，제출료일충전신적기우전류맥충개솔적반도체전화화가공사복공제방법，대상관계통삼수진행료우화，최종실현료반도체전화화고효、정밀、은정가공。
The failure reason of the EDM servo control systems based on metal processing when used in the machining of semiconductor is analyzed. Due to the sampling voltage semiconductor pro-cessing is no longer just discharge channels voltage, but the sum of the plasma channel voltage, the voltage drop on semiconductor body resistance and voltage drop of contact barrier, which makes the system unable to identify accurately the processing state, thus resulting in the failure of the servo feed. The relationship between feed speed and the probability of current pulse was studied, and a new semi-conductor EDM servo control based on current pulse probability method was put forward. The related system parameters were optimized, and finally the efficiency, precision and stability machining of semi-conductor by WEDM is realized.