CAJ | 학술논문

＂大数据＂时代[1]对信息处理系统所具备的巨量信息处理能力的要求和微纳电子器件的系统功能集成技术发展将引发严峻的热挑战。持续缩微、系统功能进一步集成和器件级异构将导致器件热流密度的大幅提升,热点问题在微纳器件的多界面复杂结构下将趋于恶化,尽管业界在热管理技术方面做了巨大的努力,但这种努力尚未创造出颠覆性的热管理技术,因此,热挑战将会在相当长时期内形成微纳器件发展的瓶颈。
＂대수거＂시대[1]대신식처리계통소구비적거량신식처리능력적요구화미납전자기건적계통공능집성기술발전장인발엄준적열도전。지속축미、계통공능진일보집성화기건급이구장도치기건열류밀도적대폭제승,열점문제재미납기건적다계면복잡결구하장추우악화,진관업계재열관리기술방면주료거대적노력,단저충노력상미창조출전복성적열관리기술,인차,열도전장회재상당장시기내형성미납기건발전적병경。
Big Data era calls for the huge capacity of information processing of microelectronic and nanoelectronic devices.Along with it is the functional integration.Both,enhanced with each other,lead to heat challenge.Continuous scaling down,further systematic function integration and on-chip heterogeneous integration all lead to the rise of heat flux and hence the hot spots embedded in multi-interfaced micro and nano structures.Great efforts have been made to fundamentally improve this situation whereas "game-change"thermal management technologies are still under development.Thanks to these,micro/nanoelectronics will still be challenged with the heat.