CAJ | 학술논문

　　通过对三种不同机理的锡渣还原试剂还原出来焊料的还原率、上锡性、润湿性、组成成分及熔点的测试与分析，探索锡渣还原试剂的使用对焊锡品质的影响。结果表明：三种还原率均超出80%；还原剂可增强焊料的上锡性；还原剂对焊料的润湿性有影响；还原前后焊锡的成分变化不明显，不影响焊锡的熔点。通过对比试验，评估锡渣还原试剂在焊料焊接生产中的适用性，并给出未来锡渣还原剂仍需改进的方向。
　　통과대삼충불동궤리적석사환원시제환원출래한료적환원솔、상석성、윤습성、조성성분급용점적측시여분석，탐색석사환원시제적사용대한석품질적영향。결과표명：삼충환원솔균초출80%；환원제가증강한료적상석성；환원제대한료적윤습성유영향；환원전후한석적성분변화불명현，불영향한석적용점。통과대비시험，평고석사환원시제재한료한접생산중적괄용성，병급출미래석사환원제잉수개진적방향。
The effects of solder quality using three reductants of solder splash ware explored by test analysis of solders reduction rate, solderability, wettability, composition and melting point. The results indicated that the reduction rates of three reductants exceeded 80%. Solders reductant could improve solderability, but the effect was a little more than raw solder bar. Solder wettability was effected by reductants. Solder compositional variations ware unconspicuous before and after reduction, and solder melting points ware constant. Solder reductant applicability is estimated in the production process and the orientation of solder reductant improvements in the future are given by contrast tests.