CAJ | 학술논문

　　LCCC封装器件具有体积小和电性能好的特点，因此应用越来越广泛。但是，由于其无引线特点，以及本体材料与基板FR-4材料的热膨胀系数不匹配，在温度变化过程中焊点应力集中，容易导致疲劳失效。在分析LCCC封装器件高可靠焊接要求和影响焊点可靠性寿命因素的基础上，分别选择28引脚、44引脚和64引脚三种LCCC封装器件进行焊接试验，并通过温度循环试验验证焊点的可靠性，最终得出验证结果。
　　LCCC봉장기건구유체적소화전성능호적특점，인차응용월래월엄범。단시，유우기무인선특점，이급본체재료여기판FR-4재료적열팽창계수불필배，재온도변화과정중한점응력집중，용역도치피로실효。재분석LCCC봉장기건고가고한접요구화영향한점가고성수명인소적기출상，분별선택28인각、44인각화64인각삼충LCCC봉장기건진행한접시험，병통과온도순배시험험증한점적가고성，최종득출험증결과。
The LCCC package has the advantages of small volume and good electric properties, so it is widely used. However, the stress concentration of solder joint of LCCC package easily causes the creep-fatigue damage as the temperature change, because of LCCC package characteristics of no leads, the coefficient of thermal expansion doesn’t match with FR-4. Select 28 pin, 44 pin and 64 pin package for soldering experiments, and verify the reliability of solder joints through the temperature cycling test, according to the requirements of high-reliablility soldering and the factors which affect relialility of solder joint. And get the guidance to improve soldering quality of LCCC packag.