CAJ | 학술논문

　　采用脉冲电沉积在A3钢表面制备Cu-SiC镀层，采用BP网络模型对脉冲电沉积Cu-SiC镀层的镀速进行预测研究。结果表明：本BP模型为3×9×1型神经网络模型，预测值与试验值曲线吻合较好；其相对误差较小，最大误差为2.7%，其相关系数为0.999，能较好地预测脉冲电沉积Cu-SiC镀层的镀速。
　　채용맥충전침적재A3강표면제비Cu-SiC도층，채용BP망락모형대맥충전침적Cu-SiC도층적도속진행예측연구。결과표명：본BP모형위3×9×1형신경망락모형，예측치여시험치곡선문합교호；기상대오차교소，최대오차위2.7%，기상관계수위0.999，능교호지예측맥충전침적Cu-SiC도층적도속。
The Cu?SiC coatings were deposited on the surface of A3 steel by pulse electrodeposition method. And a BP model was used for forecasting the plating rate of Cu?SiC coating. The results indicate that the BP model is 3×9×1 neural network model. The predicted values agree well with experimental values,the relative error is small,and the max error is 2.7%,the coefficient of correlation is 0.999. This BP model can be used to predict the plating rate of pulse electrodeposited Cu?SiC coatings.