CAJ | 학술논문

　　针对金属基体与陶瓷颗粒之间润湿性差的问题，采用化学镀铜对SiC颗粒进行表面改性，试图提高其界面结合能力。采用正交试验方法优化化学镀铜参数，探讨镀液参数对复合粉体质量增加效果的影响。研究表明：化学镀铜过程中，随着硫酸铜浓度和甲醛浓度增加，镀后复合粉体质量增加率增加；随着络合剂浓度增加，质量增加率逐渐降低；化学镀铜参数优化后可实现SiC粉体表面化学镀铜层的均匀镀覆。
　　침대금속기체여도자과립지간윤습성차적문제，채용화학도동대SiC과립진행표면개성，시도제고기계면결합능력。채용정교시험방법우화화학도동삼수，탐토도액삼수대복합분체질량증가효과적영향。연구표명：화학도동과정중，수착류산동농도화갑철농도증가，도후복합분체질량증가솔증가；수착락합제농도증가，질량증가솔축점강저；화학도동삼수우화후가실현SiC분체표면화학도동층적균균도복。
In order to improve the wettability between the metal matrix and ceramic particle,the electroless copper plating technology was used to treat the SiC particle for improving the interface bonding capacity. The orthogonal design method was utilized to optimize plating parameters and the effect of solution parameters on the weight gain rate of SiC particle was discussed. The experimental results show that the weight gain rate of SiC particle increases after electroless copper plating when the concentration of CuSO4 and CH3CHO increases,while the weight gain rate gradually reduces with the concentration increase of the chelating agent. The homogeneous plating layers on the SiC particle can be obtained after the parameters optimization of electroless copper plating.