CAJ | 학술논문

文章研究采用CO2激光器研究了HDI印制电路板制作微孔的技术，通过金相显微镜分析了CO2激光器制作的盲孔的锥形度、孔壁角度和孔壁平整性。讨论了激光参数对孔的影响，用优化试验优化参数进，一步确定了真圆度和上下孔径比最优的脉冲能量、脉冲宽度、脉冲次数和光罩尺寸。得到了不同孔径微孔的制作最优工艺参数。
문장연구채용CO2격광기연구료HDI인제전로판제작미공적기술，통과금상현미경분석료CO2격광기제작적맹공적추형도、공벽각도화공벽평정성。토론료격광삼수대공적영향，용우화시험우화삼수진，일보학정료진원도화상하공경비최우적맥충능량、맥충관도、맥충차수화광조척촌。득도료불동공경미공적제작최우공예삼수。
This paper has studied the process and theory of fabricating micro-via using the CO2 lasers on the HDI high density interconnect printed circuit board. Experiment described the process of fabricating micro-via in FR4 substrates using the CO2 laser. Bind via was drilled and evaluated for taper, wall-angle and smoothness through metallurgical microscopy. The effects of the process parameters such as pulse energy, pulse width, the number of pulses and mask dimension were also studied and further optimized. The best process parameters for micro-via with different sizes have been fund.