电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
4期
45-48
,共4页
高密度SIP%开腔%键合
高密度SIP%開腔%鍵閤
고밀도SIP%개강%건합
high-density SIP%open cavity%wire bonding
随着SIP设计技术的不断发展,SIP设计的系统也日趋复杂。高密度SIP设计是SIP设计师必须解决的设计挑战,也是需要掌握的重要技术。对于SIP设计而言,系统的热耗散问题和信号完整性问题都至关紧要,是设计成败的关键。设计SIP时,必须事先仿真由系统功耗引起的温度分布状况和信号完整性情况,分析其对系统各方面的影响,并研究相应的处理方法。结合实际工程,利用Cadence 16.6 SiP软件设计了一款高密度SIP芯片,对设计流程和关键技术做了介绍,较好地实现了高效可靠的高密度SIP设计。
隨著SIP設計技術的不斷髮展,SIP設計的繫統也日趨複雜。高密度SIP設計是SIP設計師必鬚解決的設計挑戰,也是需要掌握的重要技術。對于SIP設計而言,繫統的熱耗散問題和信號完整性問題都至關緊要,是設計成敗的關鍵。設計SIP時,必鬚事先倣真由繫統功耗引起的溫度分佈狀況和信號完整性情況,分析其對繫統各方麵的影響,併研究相應的處理方法。結閤實際工程,利用Cadence 16.6 SiP軟件設計瞭一款高密度SIP芯片,對設計流程和關鍵技術做瞭介紹,較好地實現瞭高效可靠的高密度SIP設計。
수착SIP설계기술적불단발전,SIP설계적계통야일추복잡。고밀도SIP설계시SIP설계사필수해결적설계도전,야시수요장악적중요기술。대우SIP설계이언,계통적열모산문제화신호완정성문제도지관긴요,시설계성패적관건。설계SIP시,필수사선방진유계통공모인기적온도분포상황화신호완정성정황,분석기대계통각방면적영향,병연구상응적처리방법。결합실제공정,이용Cadence 16.6 SiP연건설계료일관고밀도SIP심편,대설계류정화관건기술주료개소,교호지실현료고효가고적고밀도SIP설계。
Along with the developing of SIP designing technology, the SIP designed system is becoming more and more complicated. SIP stylists are need to resolve the challenge of high-density SIP item, and required to command the important technology. To the design of SIP, the critical points are heat-dissipation and signal-integrality, which are the keys for a successful design. At the beginning of design, simulations for heat-distribution and signal-integrality must be done to analyze its affection to the system for a method to dealing with. The paper designed a High-density SIP chip using the SiP software cadence 16.6, introduced the design-flow and the key-technology, and preferably actualized valid and reliable high-density SIP design.