印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
4期
186-189
,共4页
魏峥%史宏宇%李艳国%罗娜
魏崢%史宏宇%李豔國%囉娜
위쟁%사굉우%리염국%라나
半固化片%胶体%渗流%达西定律
半固化片%膠體%滲流%達西定律
반고화편%효체%삼류%체서정률
Prepreg%Colloid%Seepage%Darcy's Law
文章定量分析了半固化片对盲埋孔填胶的影响因素,在此基础上,正交分析确定了盲埋孔填胶的主要控制因素(填胶深度和PP片数量),为前端工程设计和控制提供依据。最后,建立盲埋孔填胶的胶体流动模型,即在层流状态下的渗流模型,服从达西定律。
文章定量分析瞭半固化片對盲埋孔填膠的影響因素,在此基礎上,正交分析確定瞭盲埋孔填膠的主要控製因素(填膠深度和PP片數量),為前耑工程設計和控製提供依據。最後,建立盲埋孔填膠的膠體流動模型,即在層流狀態下的滲流模型,服從達西定律。
문장정량분석료반고화편대맹매공전효적영향인소,재차기출상,정교분석학정료맹매공전효적주요공제인소(전효심도화PP편수량),위전단공정설계화공제제공의거。최후,건립맹매공전효적효체류동모형,즉재층류상태하적삼류모형,복종체서정률。
The factors which affect the filling Blind-via/Buried-via with prepreg were analyzed quantitatively by orthogonal analytical methods in this article, then, the key ones (the depth of filling and the number of prepreg ) were concluded to provide the theoretical basis for the engineering design. Subsequently, the theoretical model of colloidal lfow in iflling Blind-via/Buried-via with prepreg was established by using seepage under the laminar lfow relative to Darcy's law.