CAJ | 학술논문

　　通过开展无铅波峰焊正交试验，以大量的试验数据为依据确定了无铅电子组装工艺参数，建立了无铅波峰焊工艺参数间的关系模型，考察了不同试验因素的组合对焊点缺陷率的影响，对工艺参数进行了优化，并得到了各因素对实验结果重要性的影响顺序及优化的参数结果。
　　통과개전무연파봉한정교시험，이대량적시험수거위의거학정료무연전자조장공예삼수，건립료무연파봉한공예삼수간적관계모형，고찰료불동시험인소적조합대한점결함솔적영향，대공예삼수진행료우화，병득도료각인소대실험결과중요성적영향순서급우화적삼수결과。
An orthogonal experiment of lead-free wave soldering was conducted,then the process parame-ters of the lead-free electronic assembly were confirmed on the basis of a large number of experimental data,the model of the relationship between the lead-free wave soldering process parameters was established,the influence of solder defect rate by combined collocation (interaction) between the experimental factors was investigated,the process parameters were optimized. Optimized parameters results and the order of importance of various factors on the experimental results were obtained.