CAJ | 학술논문

　　使用光学显微镜和扫描电镜(SEM)观察熔铸Cu-30CrTe、Cu-30Cr和烧结粉末冶金CuCr25等三种触头材料经真空扩散焊后的室温拉伸断口及焊接结合区纵断面的显微组织。三种触头材料具有不同的断裂特征，熔铸Cu-30CrTe材料焊接结合面的显微组织明显不同于烧结CuCr25；同时参考X射线光电子能谱(XPS)表面分析结果，对添加微量Te改进触头材料抗焊接性的机理和评判原则进行了讨论。
　　사용광학현미경화소묘전경(SEM)관찰용주Cu-30CrTe、Cu-30Cr화소결분말야금CuCr25등삼충촉두재료경진공확산한후적실온랍신단구급한접결합구종단면적현미조직。삼충촉두재료구유불동적단렬특정，용주Cu-30CrTe재료한접결합면적현미조직명현불동우소결CuCr25；동시삼고X사선광전자능보(XPS)표면분석결과，대첨가미량Te개진촉두재료항한접성적궤리화평판원칙진행료토론。
The tensile fracture at room temperature and the faying microstructures of vacuum casting Cu-30CrTe, Cu-30Cr and sintered CuCr25 contact materials after diffusion welding in vacuum were evaluated by optical microscope and SEM. It is found that there are different fracture characteristics in the materials and distinct microstructures formed at the faying surface of the Cu-30CrTe from that of the sintered CuCr25; meanwhile consulting the XPS surface analysis results of elemental content and valence state of trace Te in the Cu-30CrTe contact material, the mechanism and principles of trace Te improving the anti-welding property of the Cu-30CrTe alloy contact material are discussed.