CAJ | 학술논문

　　无铅装配需要在使用前直观的了解PCB可能的吸湿程度，以便规避和减少爆板分层的风险，故不少客户专门要求PCB厂商在内包装增加湿度卡，但湿度卡的增加可能带来对PCB表面处理的污染氧化而影响到PCB的可焊性。文章主要通过试验PCB内包装中湿度卡的放置方式，确认湿度卡对PCB不同表面处理存在的污染影响程度，进而优化和改善湿度卡在内包装放置的方式，确保在内包装需要增加湿度卡时，避免PCB受到湿度卡的污染氧化，从而保障PCB质量。
　　무연장배수요재사용전직관적료해PCB가능적흡습정도，이편규피화감소폭판분층적풍험，고불소객호전문요구PCB엄상재내포장증가습도잡，단습도잡적증가가능대래대PCB표면처리적오염양화이영향도PCB적가한성。문장주요통과시험PCB내포장중습도잡적방치방식，학인습도잡대PCB불동표면처리존재적오염영향정도，진이우화화개선습도잡재내포장방치적방식，학보재내포장수요증가습도잡시，피면PCB수도습도잡적오염양화，종이보장PCB질량。
For Lead-free soldering it is reasonable requirement to know the degree of moisture absorption of the PCB before submit the boards to assemble, so as to avoid or reduce the risk of PCBA delamination. For this purpose many customer requires HIC to be placed in the inner package. Yet putting HIC might bring in contaminate to the PCB surface ifnishing, causing solderability problem. In this article the author mainly explains the experiment which is about the HIC placement in the package, and the risk of contamination which the HIC might have to different surface treatments, as well as the improvement solutions to make sure PCB surface no to be polluted/oxidized by HIC, hence to guarantee better PCB quality.