CAJ | 학술논문

　　随着电子设备不断将更强大的功能集成到更小组件中，温度控制已经成为设计中至关重要的挑战之一，即在架构紧缩，操作空间越来越小的情况下，温度已成为影响设备可靠性最重要的因素，如何有效地带走更大单位功率所产生的更多热量是亟待解决的问题。正是从PCB材料角度出发，研究高导热板材的PCB加工过程，以及其对PCBA热量散发带来的变化。
　　수착전자설비불단장경강대적공능집성도경소조건중，온도공제이경성위설계중지관중요적도전지일，즉재가구긴축，조작공간월래월소적정황하，온도이성위영향설비가고성최중요적인소，여하유효지대주경대단위공솔소산생적경다열량시극대해결적문제。정시종PCB재료각도출발，연구고도열판재적PCB가공과정，이급기대PCBA열량산발대래적변화。
As electronic devices continue to have more powerful features within smaller size, the temperature control has become critical to one of the challenges in the design, namely, tight structure, operation of space smaller and smaller cases, the temperature has become the most important factor in equipment reliability. How to effectively take away the heart from a larger unit of power generated a serious problem. This article is from the perspective of PCB material to study the high thermal conductivity of the PCB board process and their impact on the changes brought about PCBA heat distribution.