印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
4期
118-121
,共4页
含胶量%厚度均匀性%阻抗控制%阻抗差异性
含膠量%厚度均勻性%阻抗控製%阻抗差異性
함효량%후도균균성%조항공제%조항차이성
Resin Content%Thickness Uniformity%Impedance Control%Impedance Difference
层压时，板边溢胶会导致板边介质层厚度较板中间薄、介电常数较板中间高。板边介质层厚度、介电常数偏差均会对阻抗造成影响。本文对此差异性进行了试验和探讨，并明确相应的设计规则，确保阻抗附连板忠实代表客户的设计要求。
層壓時，闆邊溢膠會導緻闆邊介質層厚度較闆中間薄、介電常數較闆中間高。闆邊介質層厚度、介電常數偏差均會對阻抗造成影響。本文對此差異性進行瞭試驗和探討，併明確相應的設計規則，確保阻抗附連闆忠實代錶客戶的設計要求。
층압시，판변일효회도치판변개질층후도교판중간박、개전상수교판중간고。판변개질층후도、개전상수편차균회대조항조성영향。본문대차차이성진행료시험화탐토，병명학상응적설계규칙，학보조항부련판충실대표객호적설계요구。
Because of resin lfow during lamination, mediμm thickness in the center of board is usually thicker than that on the edge, and dielectric constant of mediμm on the edge is higher than that in the center. The purpose of this article is to discuss and research the difference, conifrm the design rule, and make sure the coupon can represents customer’s design requirement.
