CAJ | 학술논문

文章通过对电镀软金过程采用不同的电镀时间，电流密度，电镀次数形成不同的金、镍层厚度的板件，用盐雾和酸雾实验研究不同工艺加工的金面耐腐蚀性差异，结果发现金厚是影响金面耐腐蚀性的关键因素，文章还对金面的耐腐蚀性机理进行了探讨。
문장통과대전도연금과정채용불동적전도시간，전류밀도，전도차수형성불동적금、얼층후도적판건，용염무화산무실험연구불동공예가공적금면내부식성차이，결과발현금후시영향금면내부식성적관건인소，문장환대금면적내부식성궤리진행료탐토。
The paper test the gold surface corrosion resistance of PCB with using salt fog and acid fog experiments. The gold surface was produced by soft gold plating with different processing technology that including plating time, current density. The result found that thickness of gold is the key factor. The paper also probes the failure theory of the gold surface corrosion resistance.